thuatnt
Trần Thuật Nguyễn • Joined a year ago
Projects
2 Projects
thuatnt/MulColRO
Accurate, high speed, real-time reading and acquisition of signals from an array of sensors, such as temperature ones, often require advanced signal amplification and noise filtering. Arrays of sensors are used widely in practice, especially in operations and handling that require receiving signals from many different points. In this mixed-signal design, we will develop a multistage signal amplification and readout channel, including a low-noise differential amplifier stage, integrating amplifier stage, correlated double sampling stage, sample and hold stage. Except for the differential stage, the other ones are implemented via an operational amplifier and other microelectronic components such as capacitors and field effect transistors. When applied to an array of sensors, these amplifier and readout channels can be arranged in a parallel manner, ensuring that the outputs of at least 16 (depending on available bonding pads per design) sensors can be simultaneously connected. These output signals will be further processed (off-chip) by analog-digital converters before being hand over to the final processing and monitoring system.
thuatnt/UNICCASS_precheck_MulColRO
Accurate, high speed, real-time reading and acquisition of signals from an array of sensors, such as temperature ones, often require advanced signal amplification and noise filtering. Arrays of sensors are used widely in practice, especially in operations and handling that require receiving signals from many different points. In this mixed-signal design, we will develop a multistage signal amplification and readout channel, including a low-noise differential amplifier stage, integrating amplifier stage, correlated double sampling stage, sample and hold stage. Except for the differential stage, the other ones are implemented via an operational amplifier and other microelectronic components such as capacitors and field effect transistors. When applied to an array of sensors, these amplifier and readout channels can be arranged in a parallel manner, ensuring that the outputs of at least 16 (depending on available bonding pads per design) sensors can be simultaneously connected. These output signals will be further processed (off-chip) by analog-digital converters before being hand over to the final processing and monitoring system.